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Wednesday 19th November 2003
Europe’s ASML and Japan’s Dainippon Screen Manufacturing have agreed to jointly develop seamless litho-clustering methods. The term "litho-cluster" describes the linking of track and lithography systems. The companies plan to instal Dainippon Screen’s track systems in the ASML Development Laboratory in Veldhoven, the Netherlands.
Wednesday 19th November 2003
Tokyo Electron (TEL) and Clariant’s Japanese subsidiary have jointly developed surfactant rinse (FIRM) solutions and processes for the formation of ultra-fine patterns in semiconductor production. The processes are now ready for sale.
Wednesday 19th November 2003
IMEC’s 300mm fab construction project is the subject of a EUR46.8mn loan agreement with Fortis Bank. The European Investment Bank (EIB) supports the deal. The Flemish government previously advanced EUR37.2mn in November 2002.
Wednesday 19th November 2003
BOC Edwards has secured the supply of all bulk gases, bulk & speciality gas distribution and chemical & slurry management systems for a "large semiconductor manufacturer's new wafer fabrication facility near Shanghai", China. The services include complete design, engineering, installation, start-up and commissioning, including sustained operations for the bulk gas pad.
Wednesday 19th November 2003
US foundry DALSA Semiconductor has selected EV Group as the strategic supplier for micro-electro-mechanical system (MEMS) wafer bonding and thick polymer lithography production equipment.
Thursday 13th November 2003
Two lithography exposure tool companies released comments on the prospects for immersion lithography, where water is planned to be used as an optical medium to extend 193nm resolution.
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Thursday 13th November 2003
Concerns that UK industry is not responding effectively to new European environmental measures has led the UK government departments of Trade and Industry (DTI) and Environment, Food and Rural Affairs (DEFRA) to issue two new guidance documents to the chief executives of every UK company in the electrical/electronics sector.
Thursday 13th November 2003
Philips Electronics claims the industry's first complete plug-and-play Bluetooth solution in a single, low-cost chip package. The Bluetooth local wireless communication standard is aimed at applications such as mobile phones, headsets, car kits and PDAs.
Thursday 13th November 2003
Philips Electronics claims a breakthrough in LDMOS (laterally diffused metal oxide semiconductor) technology that its says can reduce the complexity and operating costs of 3G cellular base stations while at the same time enhancing their performance and reliability.
Thursday 13th November 2003
EV Group (EVG) has successfully installed an EVG501 wafer bonding system and an EVG620 precision alignment system for double-side lithography at McGill University’s Nanotool Micromachining fab in Montreal, Quebec, Canada.
Thursday 13th November 2003
Researchers at Motorola's semiconductor labs have built a "Multiple Independent Gate Field Effect Transistor" (MIGFET). The device allows for one transistor to contain multiple independent gates. Motorola claims it as a "first-of-its-kind". The company believes that the transistor could provide a major boost to the continuing drive toward smaller, more powerful chips.
Thursday 13th November 2003
Researcher Carlos Gonzalez from the Department of New Materials at CIDETEC (Basque Country, Spain) has developed a cosmetic false nail that can change colour.
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Thursday 13th November 2003
Intel says that it has identified new materials as high-k gate dielectric and gate metal to replace those used to manufacture chips for more than 30 years. Intel says that the new high-k material reduces leakage by more than 100 times over silicon dioxide.
Friday 7th November 2003
TRONIC’S Microsystems, a developmer and producer of custom MEMS (Micro Electro Mechanical Systems) for high-end applications, today held the inauguration of its new state-of-the-art MEMS production facility in Crolles, France. The company is enhancing its production capacity of high performance, high value add custom MEMS products based on specialized thick silicon-on-insulator (SOI) micromachining processes.
Friday 7th November 2003
The Semiconductor Industry Association (SIA) has released its annual forecast for 2003-2006, highlighting a strong growth forecast for 2004.
Friday 7th November 2003
Agere Systems has announced it has produced the fastest working high-speed serial interface circuits in 90 nm low-k technology. Agere's 90nm serialiser/deserialiser (SerDes) technology will enable speeds of 12 gigabits per second (Gbits/s), 20 percent faster than currently available technology.
Friday 7th November 2003
IQE, an outsource supplier of advanced wafers to the semiconductor industry, has announced the successful completion of a Placing and Open offer, raising £18.75 million (£17.9 million net of expenses).
Friday 7th November 2003
The worldwide semiconductor equipment market has begun its much anticipated albeit small recovery in 2003, according to the report recently published by The Information Network.
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Thursday 6th November 2003
West Associates appointed Distributor for Qualiflow in UK & Ireland Whatever you are doing with gases, West Associates probably has a gas handling product that would help. After 12 successful years distributing: · NuPure Point Of Use gas purifiers (sub ppb purity whether it is argon, arsine or ammonia) · Firechek pneumatic shut-off valves (temperature triggered) · Emergency Containment Systems gas cylinder containment vessels · AXT VGF GaAs & InP wafers (2” – 150mm, Semi Insulating or Semi Conducting)) West Associates has now added Qualiflow to the stable, to offer: · Mass Flow Controllers & Meters (digital & analogue) · Liquid Flow Controllers · Vapour Flow Controllers · Bellows valves · Diaphragm valves · Manifolds Qualiflow’s own product range has extended significantly, following their merger with Jipelec and acquisition of a 33% share of Lintec, both leading manufacturers of liquid vaporization systems. Liquid evaporation is thought to be a key technology in the manufacturing of the next generation of integrated circuits. If you have a specific purifier need let us know the details here Purifier RFQ and we will send you the appropriate quotation & data sheet. Otherwise, tell us what you are doing with gas and we’ll keep you updated with the relevant product news click here.
Friday 31st October 2003
EV Group (EVG) and Silicon Genesis (SiGen) announced a wide ranging co-operation in the field of low-temperature wafer bonding based on a license of SiGen's NanoBond patents and process technologies.
Friday 31st October 2003
Tronic’s Microsystems and Sercel presented the results of a strategic partnership for the fabrication of a new generation of seismic sensors, or geophones, based on micro-electro-mechanical system (MEMS) technology. Tronic’s optimised and then industrialised a prototype that was jointly developed by Sercel and the French CEA Leti microelectronics laboratory. Tronic’s has already ensured the first series production of the seismic sensors and is now in volume production.
Wednesday 29th October 2003
Sony restructuring proposals see semiconductor technology as a "core sector" for the company. Semiconductors will be part of Sony’s "convergence strategy" for home and mobile electronics.
Wednesday 29th October 2003
The Arizona State University (ASU) NanoFab has bought an EVG620 precision alignment system and EVG520HE Hot embossing and wafer bonding system from EV Group (EVG). ASU NanoFab is developing a southwest USA regional centre of excellence. A major research instrumentation award from the US National Science Foundation allows ASU to invest in equipment to enhance the university's capability to create biochips.
Wednesday 29th October 2003
STMicroelectronics has made a joint development agreement with MobiDiag to create a complete system for genomic-based detection of infectious diseases based on a silicon micro-electro-mechanical systems (MEMS) biochip. The system will allow clinical diagnostics laboratories faster, cheaper, and more user-friendly access to genomic-based techniques for infectious disease detection.

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