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Tuesday 28th October 2003
The Auction of State-of-the-Art Optical and Semiconductor Fabrication Tools will include: Thermo VG Semicon V100 HU Molecular Beam Epitaxy System & Semiconductor Fabrication Tools Auction Starts November 12, 2003 at 9:00 AM EET Auction Ends November 12, 2003 at 11:00 PM EET Visit: http://www.dovebid.com/Auctions/AuctionDetail.asp?auctionID=2258&referraltag=cohef Email: [email protected] To participate in this auction log on to www.dovebid.com, register for an account, and start to bid. Once you set up an account, you’re ready to participate in any DoveBid Featured Online Auction! Prior to the auction, preview the assets online via digital photos and comprehensive descriptions. You can also inspect the assets in person in Tampere, Finland. When you find an item you want to bid on, enter your bid amount in the “bid box”, and then monitor your bid as others compete against you. Be sure to click the "refresh" button on your web browser often to keep the bid information on your screen updated. A timer displays how much time is remaining before the lot closes. And when the time runs out, the highest bidder wins! DoveBid sends an immediate email notification to all bidders who win assets.
Tuesday 28th October 2003
Intel gave details of a strained silicon transistor that is being used in its next-generation 90nm process. The process is to be ramped this year at the company’s 300mm fabs in Hillsboro, Oregon, and Albuquerque, New Mexico. And next year (H1 2004), the process will come to Europe at Intel’s fab in Leixlip, Ireland.
Monday 27th October 2003
eupec has opened a new production facility for insulated gate bipolar transistor (IGBT) power semiconductor modules in Cegled, Hungary.
Monday 27th October 2003
A new method to completely remove SU-8 photoresist from micro structured components has been developed by a team of experts from the Institut fuer Mikrotechnik Mainz (IMM) and the M-O-T Mikro-und Oberflaechentechnik in Germany.
Monday 27th October 2003
EV Group (EVG) has joined an IMEC joint development on wafer-level packaging and micro-electro-mechanical system (MEMS) wafer bonding. EVG also becomes an official partner in IMEC's Industrial Affiliation Program (IIAP) on "wafer-level-packaging on Cu/low-k back-end-of-line" and will supply IMEC with new state-of-the-art mask alignment, spray-coating and wafer bonding tools.
Monday 27th October 2003
Infineon Technologies says that its new LightMOS insulated gate bipolar transistor (IGBT) offers up to 25% annual cost reductions when used in electronic lamp ballasts (ELB) compared with conventional magnetic lamp ballasts.
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Monday 27th October 2003
Motorola China Electronics and Semiconductor Manufacturing International Corporation (SMIC) have agreed a long-term, strategic relationship.
Monday 27th October 2003
ASML Optics’ PerfectWave metrology standard enables reliable measurement of dimensions approaching the atomic scale. Flatness variation of the disk is just 1nm, or about 10 atomic layers, across its 100mm diameter.
Monday 27th October 2003
MEMSCAP has entered into a definitive agreement to acquire the Grenoble-based company Opsitech in France. The acquired company is a spin-off from the French "Laboratoire d'Electronique et des Technologies de l'Information (LETI)" of the "Commissariat a l'Energie Atomique (CEA)". Opsitech specialises in integrated optics that can be associated with micro-electro-mechanical systems (MEMS).
Monday 27th October 2003
Maxim Integrated Products has bought Philips’ 200mm semiconductor wafer fabrication facility in San Antonio, Texas. Maxim believes that the facility is capable of producing revenues of $500 million per year. The purchase price for the campus, facility, and all equipment is $40mn.
Monday 27th October 2003
Motorola reports that it has produced the world's first 4Mbit magnetoresistive random access memory (MRAM) chip. Select customers are currently evaluating samples.
Friday 17th October 2003
Infineon Technologies is to outsource payroll accounting, major parts of recruitment and student intern hosting in Germany and Austria. The company taking up these activities for Infineon is EDS of Russelsheim, Germany.
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Friday 17th October 2003
Infineon, Intel, Philips, Samsung Electronics and STMicroelectronics have joined IMEC’s new sub-45nm research platform as "core partners". IMEC has a target of eight to ten core partners in all. The work will involve use of IMEC’s 300mm "research foundry" facility currently under construction.
Thursday 9th October 2003
Omron has developed a front-light manufacturing technology designed to create brighter, clearer liquid crystal display (LCD) screens while reducing power consumption. The technique is based on a hybrid integration of a nano prism array (200nm) with a micro prism array (3microns). The key parameters for screen lighting are low power consumption, brightness and contrast. The technique achieves a three-fold improvement in contrast ratio compared with front lights manufactured by other companies, says Omron.
Thursday 9th October 2003
Philips is to participate as a core partner in IMEC's sub-45nm research programmes. Research will start on 200mm and gradually transition to 300mm.
Thursday 9th October 2003
Motorola intends to separate its semiconductor operations into a publicly traded company. The move aims to increase the company’s focus on communications and integrated electronic systems.
Thursday 9th October 2003
Motorola is to provide Honeywell with access to magneto-resistive random access memory (MRAM) non-volatile memory chip technology, under a technology transfer and licensing agreement.
Thursday 9th October 2003
STMicroelectronics’ Discretes and Standard ICs Group (DSG) plans to advise and provide technical support to Carsem in development of copper clip interconnects for Micro Leadframe Packages (MLPs), under a memorandum of understanding between the companies.
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Monday 6th October 2003
BAOBERLIN in Germany has developed a high power light emitting diode (HL-LED). The company says that the device generates 20 times higher light output because currents reach 600mA rather than the 30mA typical with 2.8x3.2mm2 formats.
Monday 6th October 2003
SUSS MicroTec has developed a method of plasma surface activation and wafer to wafer bonding for silicon on insulator (SOI) and strained silicon applications. nano PREP reduces the process temperature to 200C allowing new applications for wafer level integration of CMOS and micro-electro-mechanical systems (MEMS) or CMOS and nanotechnology. The technology uses atmospheric pressure plasma to generate a molecular level surface modification to enable the low temperature bonding.
Friday 3rd October 2003
Holding the largest stock of used vacuum equipment in the UK, we supply world wide Reconditioned Rotary Pumps, Dry Star, Diffusion Pumps, Coaters, Degassing and Casting Systems components, spares and service. To register for updates via email relating to our products or see our latest stock please click here
Friday 3rd October 2003
Infineon Technologies is offering lead- (Pb-) and halogen-free DRAM components and memory modules.
Friday 3rd October 2003
The University of Duisburg has developed an optical measurement technique for quality control of nano electronic circuits that are developed using nano imprint lithography (NIL). The system was produced in co-operation with a microelectronic manufacturer.
Friday 3rd October 2003
Sigma-C has raised $2.87mn in a first round of financing from Deutsche Venture Capital (DVC). Sigma-C plans to use the money to accelerate the launch of design-to-manufacture software products for the semiconductor industry that more closely link electronic design automation (EDA) software, photomask production and wafer fabrication.

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