News Article
STATS ChipPAC expands manufacturing floor in Malaysia
STATS ChipPAC Limited, an independent semiconductor test and advanced packaging service provider, has announced it has expanded the production floor in its Ulu Klang Free Trade Zone plant in Kuala Lumpur, Malaysia.
The Company has converted approximately 20,000 square feet of office space into additional production floor space, increasing the total manufacturing floor space to 230,000 square feet. The overall size of the STATS ChipPAC Malaysia facility is 488,000 square feet.
STATS ChipPAC Malaysia offers high volume, low cost turnkey solutions including assembly, test and distribution. The Malaysia facility is the primary site for STATS ChipPAC's Quad Flat No-Lead (QFN) manufacturing. In addition to the floor space expansion, STATS ChipPAC Malaysia has been rapidly building its QFN capacity, investing approximately US$140million since 2004, with an additional US$25 million planned in 2008 to expand its QFN packaging and Radio Frequency (RF) test capabilities.
"We are pleased with the growth taking place at our Malaysia facility. Production capacity has increased approximately 40% over the past 12 months, with plans for continued growth in the future," said Lew Hon Sang, Managing Director and President, STATS ChipPAC Malaysia.
This expansion complements STATS ChipPAC's strategy to build its portfolio of advanced technology offerings by focusing on areas with long term growth such as QFN packaging and RF test. Revenue at the Malaysia factory has increased approximately 24% from 2005 to 2007 as a result of its expanded QFN manufacturing and RF test operations.
"STATS ChipPAC Malaysia is well positioned in the next two to three years to support customer demand in the computing, communications and consumer end markets, and is our 'Centre of Excellence' for QFN," said Tan Lay Koon, President and Chief Executive Officer, STATS ChipPAC.
