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Wednesday 24th June 2026
GigaDevice and Qt Group Announce global partnership
Tuesday 23rd June 2026
Synopsys launches multiphysics solutions
Tuesday 23rd June 2026
MIT Lincoln Laboratory invests in two AIXTRON Hyperion 300 mm systems
Monday 22nd June 2026
Imec achieves breakthroughs in ferroelectric memory research
Monday 22nd June 2026
Renesas acquires Pictorus
Monday 22nd June 2026
AI investment expected to drive semiconductor industry past $2 trillion by 2027
Monday 22nd June 2026
Sony and imec unveil high-density backside connectivity module
Monday 22nd June 2026
Electronic Design Automation market size worth $43.07 billion by 2034
Monday 22nd June 2026
CEA-Leti scales ferroelectric RAM to 22nm node
Monday 22nd June 2026
ASML, TSMC and imec bring industry-ready 2D-material transistors closer
Monday 22nd June 2026
CEA‑Leti advances European FD-SOI innovation with GlobalFoundries
Monday 22nd June 2026
Veeco receives follow-on order for Nanosecond Annealing System
Monday 22nd June 2026
Photon Design adds silicon modulator design capability
Monday 22nd June 2026
Imec unlocks system-level III-V chiplet integration on Si-CMOS
Thursday 18th June 2026
Redesigned high-NA lithography optical system aims to revolutionize semiconductor chip making
Wednesday 17th June 2026
New EU Photonics roadmap warns Europe cannot take its technological lead for granted
Tuesday 16th June 2026
Presto Engineering and Menta form strategic collaboration
Tuesday 16th June 2026
EU photonics leadership must not be taken for granted
Monday 15th June 2026
Applied Materials launches deposition and etch systems for 3D chip scaling
Thursday 11th June 2026
Imec unlocks fourfold UWB range extension
Thursday 11th June 2026
Constant gas pressure, even with extremely fluctuating consumption
Thursday 11th June 2026
Teradyne introduces integrated test solution for AI and data centre devices
Thursday 11th June 2026
NVIDIA and SK hynix form multiyear technology partnership
Thursday 11th June 2026
The FAMES payoff begins
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