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Tuesday 8th July 2014
The new company will be focused on creating and enabling technology innovations that improve the way people live
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Monday 7th July 2014
This development will extend Orbotech's position in advanced packaging and MEMS markets and micro manufacturing
Monday 7th July 2014
With copper oxide nanoparticles being the best, thermal resistance decreases as the volume fraction of nanoparticles is increased
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Monday 7th July 2014
One of the firm's key customers has decided to temporarily discontinue all Topsil silicon supplies
Monday 7th July 2014
The firm will showcase its solutions, including a 300mm interposer stepper, at SEMICON West 2014 at booth #2105. The exhibit will go under the slogan “Next-Generation Packaging Solutions”
Friday 4th July 2014
The devices feature ultra-low RDSON in standard and performance power packages for industrial applications
Friday 4th July 2014
A new type of computer chip incorporates a tiny, low-power transceiver, on-chip antennas and communication protocols that enable wireless shortcuts

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