Info
Info
News Article

R&D

Researchers from Kyoto University, Japan, have developed an electochemical technique for extracting silicon from silicon dioxide (Nature Materials, Advance Online Publication, May 18, 2003). Conventionally, SiO2 is reduced to Si by carbothermal reduction. The electrochemical technique involves removing oxygen from SiO2 in a molten calcium carbonate electrolyte at 850C. The carbothermal process is normally carried out at 1700C. Electrochemical reduction in LiCl-KCl-CaCl2 at 500C was also demonstrated. The scientists hope for application of the technique in semiconductor processing and high-purity silicon production.
Researchers from Kyoto University, Japan, have developed an electochemical
technique for extracting silicon from silicon dioxide (Nature Materials,
Advance Online Publication, May 18, 2003). Conventionally, SiO2 is reduced
to Si by carbothermal reduction. The electrochemical technique involves
removing oxygen from SiO2 in a molten calcium carbonate electrolyte at 850C.
The carbothermal process is normally carried out at 1700C. Electrochemical
reduction in LiCl-KCl-CaCl2 at 500C was also demonstrated. The scientists
hope for application of the technique in semiconductor processing and
high-purity silicon production.


AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
K-Space Offers A New Accessory For Their In Situ Metrology Tools
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
Changes In The Management Board Of 3D-Micromac AG
Panasonic Microelectronics Web Seminar
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
ASML Reports €14.0 Billion Net Sales
AP&S Expands Management At Beginning Of 2021
New Plant To Manufacture Graphene Electronics
ITRI And DuPont Inaugurate Semiconductor Materials Lab
SUSS MicroTec Opens New Production Facility In Taiwan
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
TEL Introduces Episode UL As The Next Generation Etch Platform
DISCO's Completion Of New Building At Nagano Works Chino Plant
Cadence Announces $5M Endowment To Advance Research
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
Onto Innovation Announces New Inspection Platform
Will Future Soldiers Be Made Of Semiconductor?
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
EV Group Establishes State-of-the-art Customer Training Facility

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event