Micronas introduced what it calls "ActivePackage" – aimed at ridding a headache car manufacturers worldwide have shared for many years. During the life cycle of a car, several of the original integrated circuits (IC) that are designed in when the car is launched become obsolete - forcing car manufacturers to carry out expensive redesigns.

Micronas introduced what it calls "ActivePackage" - aimed at ridding a headache car manufacturers worldwide have shared for many years. During the life cycle of a car, several of the original integrated circuits (IC) that are designed in when the car is launched become obsolete - forcing car manufacturers to carry out expensive redesigns.

By physically separating the digital logic element of a chip from the I/O and creating two chips within one package, the new ActivePackage concept solves this problem, claims Micronas, along with several other difficulties caused through short IC life cycles. Up to now, it has been impossible to connect the latest controllers directly to the electrical system in the car because they could not operate with such high voltages.

With the ActivePackage approach, there will be two chips per IC package - the logic chip and the peripheral chip. This decoupling allows the core logic to be manufactured in the latest process technology. The programmable peripheral chip converts the core logics electrical parameters for external communication. This enables car manufacturers to design ICs into their cars with "frozen" electrical and mechanical parameters, saving time and money in the future.

The ActivePackage approach guarantees not only that the electrical parameters remain constant over many generations, but also the pin-out and the mechanical characteristics of the package. The programmable peripheral chip acts as part of the IC package and provides it with a whole new quality - hence the ActivePackage name.

"Up until now, car manufacturers have been forced to redesign a cars electronic control unit as soon as the IC manufacturer made a product group obsolete," said Klaus Heberle, vice president for automotive products at Micronas. "Besides being expensive, the car manufacturer has to go through a learning curve to maximise IC performance. This has proven to be a very serious problem for the adoption of electronics in cars. With ActivePackage, car manufacturers benefit from the progresses in process technology and can integrate chips with a greater level of performance while eliminating the need for redesign."

Micronas believes that chip manufacturers will also benefit as they will not need special roadmaps for their automotive clients. The functional block can always be manufactured in the latest technology and integrated into the ActivePackage, while other characteristics remain unchanged - effectively solving the lifetime supply problem through adopting a platform approach.

The ActivePackage concept requires multi-chip-packages, which can today be manufactured cost-effectively with high yields. The ICs are bonded on the lead frame and electrically connected with each other. Both steps are part of the assembly and bonding process with no other process steps required.

Micronas expects that the demand for such chips will be such that the required raw materials and production lines will be available on a long-term basis.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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