Investment & Expansion
"Unitive has produced the world's only advanced packaging foundry turning
out electroplated bumped 300 mm wafers, largely in response to a need
presented to us by a customer," reports CEO Ken Donahue. Unitive has fabs in
both North America (North Carolina) and Taiwan.
The company expects production of 300mm electroplated wafers at the rate of
4000 a month, with eutectic solder, high-lead solder, and lead-free solder
being used. Unitive will also offer passivation technology and plated wiring
technology.
Electroplating technology is a photo-defined process that can form extremely
small bumps and exceptionally tight pitches.
"We use traditional semiconductor processing techniques to create photomasks
so that we can produce much smaller structures and electroplating in those
structures and end up with much finer bump pitches," says Eric Kung,
director, UST Technology division. "We are able to produce 125micron pitches
and up, while remaining cost competitive with paste technology and showing
clear technological and processing benefits."
ST Assembly Test Services (STATS) is opening a manufacturing plant in
Shanghai, China. The facility is expected to be operationally ready by the
end of October 2003. The company will offer wafer probe and final test out
of the site for mixed-signal and high-end digital applications, including
wired and wireless communications and digital consumer products. Initial
cash investment will be approximately $10mn. A major part of this is to be
used in 2004. In addition, STATS will transfer some of its existing
production equipment from its Singapore facility to China.
The site for the 2300m2 leased facility is the Zhangjiang High Tech Park,
Pudong. The area has a large base of IC-design companies, wafer foundries
and assembly and test houses and is home to two of China's first 200mm wafer
foundries.
The company is also looking to create a full service facility offering wafer
probe, assembly and final test in China should demand grow for packaging and
testing of mixed-signal ICs. Possible sites for this additional facility are
being investigated.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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