Alliances
The aim is to establish a sound basis for enhanced
security levels in systems used in the civil service, private companies and
households. The contracting parties have agreed upon a close information
exchange in three security areas: smartcards, mobile applications and PC/
computer networks. The BMI and Infineon also intend to drive selected
projects to promote the use of secure IT in Germany. Examples for such
projects are the German citizen card incorporating a digital signature and
BundOnline 2005 - a German government initiative to make all online-capable
information services available to citizens by 2005.
The qualified signature card for every German citizen would incorporate
biometric functionality and be used for social, employment and health
services.
The PC and network security strand would include the security standards
being promoted by the Trusted Computing Group (TCG). The TCG is an industry
initiative that wants to standardise the requirements for a trustworthy PC
and to secure it against virus attacks and unauthorised manipulation. Work
on cellular phones and other mobile devices would include systems for data
encryption and payment authorisation.
Dr Ulrich Schumacher, president and CEO of Infineon, comments:
"Security
cooperations between government and the private sector, such as the one
between the German Federal Ministry of the Interior and Infineon, and the
subsequent use of silicon-based solutions, have the potential to make
Germany the pacesetter for such security solutions in Europe."
Vitesse Semiconductor will work with BAE Systems and the University of
Illinois Urbana Champain (UIUC) to develop advanced manufacturing processes
and communication ICs using the sub-micron VIP-2 indium phosphide
heterojunction bipolar transistor (InP HBT) technology under a $6mn contract
from the Defense Advanced Research Projects Agency (DARPA).
Indium phosphide allows direct digital synthesis of high-frequency signals,
thereby simplifying the system design and reducing the number of discrete
components required in advanced satellite, aircraft and terrestrial
communication systems.
The VIP-2 process is similar to Vitesse's VIP-1, currently in production, in
that it uses 100mm diameter semi-insulating substrates and is designed for
high-performance and high yield. A key difference between the VIP-1 process
and VIP-2 is the bipolar transistor structure. VIP-2 makes use of double
HBTs (DHBT), with an fT of 300GHz and an fMAX of 300GHz. These figures are
twice those of VIP-1 transistors. The VIP-2 process has four layers of metal
interconnect and includes resistors and capacitors. It provides circuit
designers the benefits of both high-speed and high-voltage operation
suitable for digital, analogue, and RF circuits at 10GHz and higher.
Vitesse will collaborate with BAE Systems on the design of communications
circuits. The initial circuits are for direct digital frequency synthesis
(DDFS) for electronic warfare and radar applications. UIUC will focus on
research for the next-generation transistor structures meant to further
extend circuit performance and applications. A factor of two improvements in
critical performance parameters has already been attained in early VIP-2
experiments at 0.45microns. Further scaling is planned, by incorporating
UIUC's findings, with the ultimate goal of shrinking device geometry to
0.25microns. This will result in static flip-flop toggle frequencies of up
to 150GHz. The initial 18-month contract contains option phases, which, if
implemented, would bring the total value of the contract to more than $15mn.
Dainippon Screen has entered into a collaborative agreement with Nikon for
the development of next-generation photolithography processes. As part of
the work, Dainippon Screen has installed its SK-3000 300mm coater/developer
at Nikon's Kumagaya plant, where research involving the SK-3000 and Nikon's
latest ArF scanner has already begun.
The SK-3000 installed in Nikon's lab will be equipped with a new developing
system with higher process performance, and a new resist coating system with
improved coating uniformity. An advanced interface between the
coater/developer and scanner will be developed along with APC (advanced
process control) systems to ensure and improve process stability.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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