ST Reports On 2002 Environmental Impact
In 2002, energy efficiency initiatives cut electricity consumption by 15% per production unit. Further, construction work began on a 10.5MW wind farm in France that will provide 33,450MWh each year. Some 600 hectares of forest were planted to sequester ST carbon emissions. An agreement was signed with the Moroccan government to plant 10,000 hectares of forest over the next six years, with planting already started.
Landfilled waste reached a record low of 10.7% of total in Q4 2002, reflecting a steady reduction to 15% for the year compared with 70% in 1994. The proportion of manufacturing waste reused or recycled has increased from 25% to 65% over the same period.
Since 2001, ST has been using the Environmental Burden Method that monitors 10 categories to evaluate the impact of emissions to water and air - the planned reduction in water consumption is ahead of target. Consumption has fallen 33% since the 1994 baseline, through recycling and purification schemes resulting in a $70mn saving.
ST also reports that since 2000 environmental improvements have saved nearly 1.5 times their cost. Environmental measures represented 1.2% of the company's investments in 2002.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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