Arizona State takes EVG tool
"With the EVG620 aligner and EVG520HE wafer bonder, we will get two flexible and proven tools to develop new applications and processes in the area of biochips, nanofluidics and bioelectronics," says Dr. Trevor Thornton, ASU NanoFab director.
Enhanced research efforts are focused on the development of chemical and biological sensors, threat detection sensors and other miniaturised devices that combine biological systems with conventional electronics.
Part of the ASU process is the precision alignment of plastic wafers on top of silicon wafers to line up channels, which is done on the EVG620 with micron level alignment accuracy. The EVG520HE is configured as a dual use system to meet the university's needs for both wafer bonding and hot embossing/nanoimprinting applications in one system. In one case, a wafer bonding technology is required to bond plastic or glass patterned with channels to silicon wafers with electronic circuits.
The EVG520HE can be also used for nanostructuring processes. Without any hardware change, the system is capable of doing nanoimprinting as a method of pattern transfer, whereby a stamp creates tiny channels in plastic by applying high contact force. Top and bottom heaters provide low thermal stress between stamps and substrates and 200mm substrate capability.
