Bluetooth system in package
The BGB202 system-in-a-package (SiP) integrates multiple technologies (radio, baseband, read-only memory, filters and other discrete components) into one package, reducing the complete Bluetooth solution footprint to 56mm2. For the complete SiP, only an external clock source and an antenna are required for proper operation.
The baseband is manufactured in a cost-effective CMOS technology while the radio subsystem uses an advanced BiCMOS technology to enhance performance. Passive integration technologies add the loop filter, the antenna filter and other discrete components.
The BGB202 is a fully certified plug-and-play Bluetooth system with all the critical RF functions built-in. The device is offered with proven, state-of-the-art software up to HCI including specific power control features and low power modes.
Philips' BGB202 is currently sampling to lead customers and will be available in production quantities in early Q2 2004.
