Litho-cluster link
Current litho-cluster integration methods use very basic wafer transfer scenarios resulting in inconsistent timing between the processes, slowing throughput. The joint programme will create interface controls for making tracks and scanners function as a single system and explore performance capabilities and process enhancements.
The two companies will also optimise the process performance required for next-generation optical lithography, including high-NA ArF, immersion ArF and F2 (157nm) lithography. In addition, the collaboration will develop automated process control (APC) systems using integrated metrology units installed in the track.
Dainippon Screen will install its 300mm RF3 coater/developer system to establish proof of concept and explore performance capabilities and process enhancements. Installation is due this month, November 2003. Higher volume tool shipments are scheduled to begin January 2004.
The RF3 is configured to provide 150 wafers per hour throughput for advanced process flows. Dainippon Screen announced plans to increase the throughput to 180 wafers per hour by 2006. The RF3 will be linked with an ASML TWINSCAN system.
