EVG supplies US MEMS foundry
Initially, EVG will provide DALSA with the GEMINI wafer bonder cluster tool and the HERCULES thick polymer lithography tool customised to DALSA's specifications. These two systems will be used to move MEMS into high volume manufacturing.
Later, the two parties intend to co-operate to enhance the capabilities of the equipment sub-modules to handle new materials and processes. DALSA expects preliminary equipment operation in four to six months.
GEMINI is designed for alignment and LowTemp dry activated plasma bonding for a wide variety of wafer types and sizes.
"DALSA will be able to fully attack the most demanding intelligent MEMS integration schemes using our unique low temperature CMOS, HV-CMOS, MEMS and CCD process technologies," says Luc Ouellet, DALSA's director of technology.
The company expects new opportunities in the automotive, industrial, RF-telecom, photonics, information technology and biomedical MEMS market segments.
