Cool new etch gas developed in Russia
Fluorocarbon gases are widely used for processing silicon dioxide films. SDK says that since C4F6 features a very low environmental load, it expects sales to reach JPY1bn in 2005. The gas decomposes in less than two days in the atmosphere, compared with 3200 years for the C4F8 gas commonly used in 130nm processes. Undecomposed perfluorocarbons have high global warming potentials.
The company says that the material achieves a high aspect ratio, resulting in narrow and deep grooves for processing at very narrow line widths. High selectivity to silicon dioxide over photoresist, silicon substrate or nitride film is also claimed. The company is seeking to meet timetable demands for 90nm in 2004, 65nm in 2007 and 45nm in 2010.
SDK says that it was the first company to complete filing of C4F6 under Japanese laws concerning Examination and Regulation of Manufacture of Chemical Substances in February 2003. SDK is also looking to fluoropolymer material applications using C4F6 as a basis monomer.
