News Article
SUSS win packaging litho order
Package and test company Advanced Semiconductor Engineering (ASE) is currently installing multiple 300mm SUSS MicroTec lithography systems.
Package and test company Advanced Semiconductor Engineering (ASE) is currently installing multiple 300mm SUSS MicroTec lithography systems.
The equipment package includes several MA300 Plus full-field lithography systems and several ACS300Plus coat/develop wafer-processing clusters.
ASE will use the tools to expand 300mm solder bumping capacity. The shipments include key elements of SUSS' recently introduced SupraYield software. Installations are scheduled for completion Q4 2003.
