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Soitec makes Japan joint venture

Soitec is to enter into an agreement with Seika, its long-time distribution partner in Japan, to form a Japanese joint venture. The new company will provide UNIBOND silicon-on-insulator (SOI) wafers and other engineered substrates manufactured using Soitec's Smart Cut technology. Apart from Japan, the venture will also serve Korea and China with a full direct sales and support organisation.
Soitec is to enter into an agreement with Seika, its long-time distribution partner in Japan, to form a Japanese joint venture. The new company will provide UNIBOND silicon-on-insulator (SOI) wafers and other engineered substrates manufactured using Soitec's Smart Cut technology. Apart from Japan, the venture will also serve Korea and China with a full direct sales and support organisation.

Soitec will acquire a 70% interest in the venture, while Seika will retain 30%. The companies expect to finalise the transaction by April 1, 2004, following the close of Soitec's current fiscal year.

Soitec has already shipped 300mm SOI wafers to some Asian countries. The company has also been selling silicon-on-quartz (SOQ) wafers - the first proven example of Smart Cut's manufacturing flexibility for material applications beyond SOI - thanks to a joint development and licensing agreement with Seiko Epson.

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