News Article
Freiberg 300mm plant on schedule
Wacker Siltronic has successfully started the first processing step at its new 300mm wafer fab at Freiberg in the German state of Saxony. The first 300 mm monocrystalline ingot was sliced into thin wafers on schedule, December 3, 2003.
Wacker Siltronic has successfully started the first processing step at its new 300mm wafer fab at Freiberg in the German state of Saxony. The first 300 mm monocrystalline ingot was sliced into thin wafers on schedule, December 3, 2003.
"I am confident that we will start shipping products to customers in June 2004 as planned," reports Dr Gerhard Brehm, project manager for the new high-volume 300mm line in Freiberg.
Wacker currently manufactures 70,000 wafers per month in Burghausen/Germany and Hikari/Japan. Final capacity in Freiberg is scheduled to be 150,000 wafers a month on full built-out. The investment of more than EUR400mn in the facility is expected to create 600 new jobs in the Freiberg area.
At Burghausen, PVA TePla reports that its Crystal Growing Systems (CGS) division successfully implemented a pilot production plant for 300mm silicon. The CGS project was supported by Germany’s Ministry for Research and Technology.
