Wafer reclaim consolidation
The fully separated copper reclaim process allows ISILTEC to meet the requirements of the leading edge customers. The acquisition complements Rockwood's existing reclaim activities with a complete range of reclaim services to the semiconductor manufacturing market. ISILTEC already supplies reclaim services to a leading European 300mm wafer fab and participates in major European research programs.
The 300mm polishing and cleaning technology used by ISILTEC is licensed from a leading silicon manufacturer. The technique ensures a surface quality equal to that of virgin wafers. The company also works in partnership with the Fraunhofer Institute.
Rockwood recently completed a $7mn facility expansion in Greasque, France. This plant supports high volume 200mm manufacturing. The company also maintains a 300mm capable reclaim facility in Arizona.
