News Article
SUSS benefits from US car safety market
SensoNor has chosen SUSS MicroTec micro-electro-mechanical system (MEMS) production equipment for the manufacture of tyre pressure sensors.
SensoNor has chosen SUSS MicroTec micro-electro-mechanical system (MEMS) production equipment for the manufacture of tyre pressure sensors.
. Three systems have been bought - two MA150e production mask aligners and an ABS150e volume production bond cluster. These will be used for lithographic and high volume aligned bond processing.
A market for 80mn tyre pressure sensor chips a year in North America alone is expected to result from new US traffic safety regulations.
Wafer-bonding is used to join two or more micromachined wafers to form complex 3D MEMS devices. The SUSS bond cluster demonstrates a post-bond alignment potential of less than 1micron, claimed as the highest alignment precision for multiple wafer bonding available in the market today.
SensorNor is an Infineon Technologies subsidiary.
