Philips looks to IBM to implement RFID technology
The first joint project will be to build an RFID system for Philips Semiconductors division manufacturing and distribution facilities covering processes within the manufacturing and distribution supply chain, inventory management and control. In a first step, wafer cases and carton packages will be tagged at Philips Semiconductors' Kao Hsiung manufacturing site in Taiwan and the division's distribution centre in Hong Kong. The project started in November 2003 and will go fully live during the course of 2004.
By teaming up with IBM, Philips plans to move beyond delivering its expertise and RFID chips towards integrated end-to-end solutions for retailers, consumer goods manufacturers and couriers. Philips provides high-security contact and contactless chip technology for smartcards and RFID chips. IBM Global Services consists of consulting, project management and implementation services as well as specialised software.