News Article
Philips progresses to lead-free
Philips Electronics has made its entire portfolio of small signal discrete plastic surface mount devices (SMD) available in 100% lead-free packaging. In these devices, tin-lead-plating will be replaced by pure matte tin (100% Sn).
Philips Electronics has made its entire portfolio of small signal discrete plastic surface mount devices (SMD) available in 100% lead-free packaging. In these devices, tin-lead-plating will be replaced by pure matte tin (100% Sn).
The conversion of Philips' small signal discretes in plastic SMD will quickly be followed by the conversion of its entire product portfolio of glass and ceramic products to lead-free. This change is aimed at the needs of meeting new legislation concerning lead-free products beginning July 2006.
In July 2001, Philips teamed up with STMicroelectronics and Infineon Technologies to develop a proposed standard for defining 'lead-free' and to develop proposed standards related to lead free products through assessment of factors such as solderability, reliability of alternative materials and characterisation of the moisture sensitivity level (MSL). These companies define lead free as being less than 1000ppm lead by weight.
