News Article
Toshiba shrinks pixels
Toshiba has used advances in process technology and design optimisation to reduce individual pixels in its latest CMOS image sensor camera module from 5.4microns to 3.75microns. This allows approximately 330,000 signal pixels to be arranged in a 492x660 array on a single chip with a 4mm optical format.
Toshiba has used advances in process technology and design optimisation to reduce individual pixels in its latest CMOS image sensor camera module from 5.4microns to 3.75microns. This allows approximately 330,000 signal pixels to be arranged in a 492x660 array on a single chip with a 4mm optical format.
The resulting TCM8230MD VGA camera module measures 6x6x4.5mm and consumes a third of the power of the previous version. The camera module also incorporates a double lens and a single chip integrating a CMOS image sensor and a digital signal processor (DSP).
Samples of the TCM8230MD are scheduled to be available in March 2004. Mass production is due in May 2004 at an initial volume of 1mn modules a month.
