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News Article

Unitive buys SUSS upgrade

Unitive has selected SUSS lithography equipment and SupraYield technology to develop next-generation packaging processes. The SupraYield installation and process development will take place at Unitive's facility in Research Triangle Park, North Carolina.
Unitive has selected SUSS lithography equipment and SupraYield technology to develop next-generation packaging processes. The SupraYield installation and process development will take place at Unitive's facility in Research Triangle Park, North Carolina.

SupraYield consists of technologies that enhance performance and increase productivity of SUSS' 1X full field lithography systems. Unitive develops wafer-level packaging technology for manufacturers of semiconductors, compound semiconductors and micro-electro-mechanical systems (MEMS).

Under the terms of the agreement, SUSS will help Unitive upgrade its installed base of SUSS 1X full-field lithography (1XFFL) systems with SupraYield Technology. SUSS will also provide technical support.

Dan Mis, vice-president for Technology Integration at Unitive, says: “By enhancing our existing SUSS full-field lithography systems with SupraYield, we can achieve high overlay accuracy and resolution of a stepper without spending additional time and resources bringing a stepper on line."

Additionally, Image Technology, a wholly owned subsidiary of SUSS, will supply full-field photomasks using Mask Pellicle Technology (MPT). Much like pellicles used for reticles, MPT prevents contamination from printing on the wafer by keeping the mask free of particles. This can help to reduce mask maintenance and improve resolution without affecting yield. MPT is one of the four building-block technologies of SupraYield.

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