SUSS France joins bonding project
The researchers plan to develop new processes to solve the problem of oxidation of indium used for high performance flip-chip bonds, fluxless solder and polymer sealing for 0-level packaging of MEMS devices and positioning of extreme thin chips and MEMS sealing caps. Additionally, IMEC will use the FC150 system for all its other advanced flip-chip bonding activities in the field of MEMS and high-density packaging.
SUSS MicroTec has supplied IMEC with an FC150 automated device bonder to perform all bonding tests during this one-year research programme. The FC150 supports a broad range of bonding processes such as thermo-compression, solder reflow, UV curing, etc.
The assembly and packaging of tiny devices has presented challenges for handling, manoeuvring and bonding sub-components with extreme exactness. MEMS commercialisation is currently hampered by the lack of miniaturised and cost-effective 0-level bonding processes.
