Applied and SOITEC join for 45nm germanium technology
The focus of the joint programme is on the development of germanium epitaxial layers that will be transferred using Soitec's patented Smart Cut technology to build GeOI wafers. Centura can apply a range of germanium epi films from 100% germanium to virtually any germanium/silicon combination.
Dr Randhir Thakur, vice president and general manager of Applied Materials' Front End Products group, comments: "Germanium compounds are expected to provide the foundation of many advanced materials in future chips, starting at the 45nm node."
Germanium-based materials allow electrons to flow faster through the material, potentially speeding transistor switching by 3-4x over silicon. Because of bulk silicon's scaling limitations - at and beyond the 45nm chip generation - many chipmakers are evaluating engineered GeOI-type substrates to enhance device performance.
