Danish packaging developer gains funds
The company’s targets are micro-machined silicon, datacom optical high speed communication links and optical telecom applications. The technology is designed to handle frequencies in excess of 40GHz and several amperes of current. Three product lines exist: HyShell, HyCap and HySembly. Hymite offers complementary services to these technologies comprising assembly, testing and fibre or connector termination.
Hans Schreck, general partner at one of the company’s investors, TVM, comments: “We believe silicon-based hermetic packaging will be an enabler of the next level of electro-optical subsystem integration, and has the potential to replace existing hermetic technologies. Integration and cost reduction will have a key impact on margins in the optical and MEMS industries in the coming years.”
