News Article
Lead-free bumping
Unitive has developed and qualified an electroplated lead-free bumping technology. Upon completing internal qualification, UST also achieved production qualification status for Infineon Technologies. The SnAg lead-free solution enables replacement of eutectic solder with a lead-free solder.
Unitive has developed and qualified an electroplated lead-free bumping technology. Upon completing internal qualification, UST also achieved production qualification status for Infineon Technologies. The SnAg lead-free solution enables replacement of eutectic solder with a lead-free solder.
Dan Mis, Unitive’s vice president of technology integration, comments: “This technology was developed and qualified over two years in our US facility then transferred to our Unitive Semiconductor Taiwan (UST) facility in Hsinchu.”
“We are the first bumping subcontractor in the world to qualify an electroplated lead-free bumping solution,” adds Daniel Teng, UST’s president. “This achievement was made possible thanks to our close partnership with Infineon Technologies.”
