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Trikon Technology Integrates K=2.4

Trikon Technologies announced successful completion of the Semiconductor Equipment Association (SEA) Advanced CVD Tool for Integration of Organosilicate Nanoporous Films (ACTION) project based at the Crolles II alliance development facility in France.
Trikon Technologies announced successful completion of the Semiconductor Equipment Association (SEA) Advanced CVD Tool for Integration of Organosilicate Nanoporous Films (ACTION) project based at the Crolles II alliance development facility in France.


The researchers integrated Trikon's Orion dielectric with k values of 2.4 with electrical performance within target specifications using the company's Planar 300 deposition system. The team was able to directly chemical mechanically polish (CMP) the Orion films and integrate them with both PVD and MOCVD barrier technology.


The European Community funded project's principal objective was to manufacture a "production worthy ultra low k CVD 200/300mm bridge tool that meets the stringent requirements of advanced IC manufacturers worldwide". The project started in May 2002 and was successfully completed in early Q1 2004. The consortia of participants evaluating the Planar 300 Orion system comprised STMicroelectronics, Philips Research, AMD Saxony and the Technical University of Chemnitz.


Trikon believes that Orion's k values can be extended down to 2.2.


Peter Sermon, Trikon's Dielectric CVD product marketing manager, comments: "We are now focused on progressing the Planar 300 Orion system through full qualification for 65nm production."

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