Intel seeks to be 95% lead-free this year
The new packages use lead-free solder balls. The company says that this application represents the majority of lead used in its microprocessor packaging. Intel is working with the industry to find a reliable solution for the tiny amount of lead still needed inside the processor packaging to connect the actual silicon chips to the package.
Intel says that it has been working since 2000 with industry consortia and the European Union's Restriction of Hazardous Substances (RoHS) legislation committee to come up with a solution that can be used around the world. To achieve this, the company developed reference procedures on its own research assembly lines to aid customers implementing lead-free technology in their manufacturing process.
Intel qualified its first lead-free plastic ball grid array package in 2001 for use with its Flash memory, and shipped its first lead-free product in 2002. The lead/tin solder previously used for connecting this package to the motherboard was replaced with a tin/silver/copper alloy. Intel's new flip chip ball grid array package also uses a tin/silver/copper alloy to connect the chip package to the motherboard. However, until Intel and the industry can certify a replacement that meets performance and reliability requirements, a tiny of amount of lead/tin (about 20mg) is still used inside the sealed package to attach the silicon core to the package.
Assembly development lines in Arizona and Oregon, along with Malaysian production facilities, were used to perfect both flip chip packages and printed circuit board assembly (PCA). The new lead-free compatible materials and assembly processes were documented as reference processes for distribution to customers and system manufacturers.
Intel will continue to ship processors with lead-solder packaging during a transition period to system manufacturers who need time to develop and qualify lead-free processes and products.
Caption: Flip-chip ball grid array package structure