News Article
Rohm and Haas joins French semi research
Rohm and Haas Electronic Materials is to work with France’s CEA-Leti microelectronic development centre on IC process integration technology targeted at the 45nm and lower nodes.
Rohm and Haas Electronic Materials is to work with France’s CEA-Leti microelectronic development centre on IC process integration technology targeted at the 45nm and lower nodes.
Together, the organisations will focus on initially addressing IC industry needs for advanced lithography as well as advanced interconnect technologies that may include ultra low-k dielectrics, low-k and copper-compatible advanced removers and novel plating chemistries.
Rohm and Haas Electronic Materials will immediately position scientists to start work on the project at the Minatec centre in Grenoble co-founded by CEA-Leti.
