News Article
Pushing flip-chip capability
The University of Hanover’s Institute for Transport and Automation is to use Muehlbauer’s FCM 6000 high-volume, low-cost flip chip mounter for its flip chip technology projects. The university is also working with Muehlbauer to characterise and develop the machine for new applications.
The University of Hanover’s Institute for Transport and Automation is to use Muehlbauer’s FCM 6000 high-volume, low-cost flip chip mounter for its flip chip technology projects. The university is also working with Muehlbauer to characterise and develop the machine for new applications.
Along with proving the reliability and placement accuracy beyond ±20microns, the researchers are looking to speed-up the tool operation. A key bottleneck is the curing time of the anisotropic conducting paste (ACP) used as the glue in many applications. This process step can take 8-15secs. The university and Muehlbauer are making contacts with a number of ACP suppliers to find a solution.
Other development work includes meeting the needs for high or low temperature processing. Among the applications for the machine are radio-frequency identification (RFID) smart labels – a growing market with a number of leading companies demanding the technology from suppliers for logistics use.
