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News Article

Hard work achieves ferroelectric results

Oki Electric Industry is acquiring an Aixtron Tricent MOCVD tool for the commercial manufacturing of high-density FeRAM non-volatile memories. The tool will be used within the framework of a three-company agreement between Aixtron, Symetrix and Oki. The initial work will produce FeRAM devices in the density range 64k-16Mbit. Engineering samples are scheduled for release by Q4 2004.
Oki Electric Industry is acquiring an Aixtron Tricent MOCVD tool for the commercial manufacturing of high-density FeRAM non-volatile memories. The tool will be used within the framework of a three-company agreement between Aixtron, Symetrix and Oki. The initial work will produce FeRAM devices in the density range 64k-16Mbit. Engineering samples are scheduled for release by Q4 2004.

Oki and Symetrix report joint development of a new kind of FeRAM at Oki’s Hachioji, Japan R&D centre with significantly faster speeds and less power consumption than existing FeRAMs in production. Simultaneously, Aixtron and Symetrix have developed the MOCVD process at Aixtron’s facilities in Aachen, Germany, and at Symetrix’ research facilities in Colorado Springs, Colorado.

“The delivery of this tool to Oki marks the successful culmination of a lot of hard development work by Aixtron and Symetrix,” comments Tim McEntee, executive vice president and chief operating officer COO for Aixtron’s Semiconductor Equipment business.

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