News Article
Memory stacking partners sought
A small German company is seeking partners for a chip stacking technology for memory modules through the Wirtschaftsförderung Berlin International business development organisation.
A small German company is seeking partners for a chip stacking technology for memory modules through the Wirtschaftsförderung Berlin International business development organisation.
The bare chip on board (COB) stacking technology has been developed for the company’s own compact flash card production with storage volumes of 256M-1GByte. A 4GByte prototype has also been developed.
Up to eight Flash memory dies of equal size can be stacked on top of each other and connected electrically through ultrasound wire bonding. A proprietary test program checks the functionality of each individual chip.
The technology allows encapsulation free of voids at a high wire density. Highly reproducible blob shapes can also be offered. The company believes that it can develop and manufacture multi-chip modules into chip-on-flex (COF) and flip chip in combination with surface mount technology (SMT).
http://www.wfbi.de
