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News Article

Dresden fab 'well on its way'

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AMD held the “topping-off” ceremony for its next-generation 300mm manufacturing facility, AMD Fab 36, in Dresden, Germany. According to AMD chairman of the board, president and CEO Hector Ruiz, the facility “will help ensure we have the capacity required to meet our customers’ - and their customers’ - needs for pervasive 64bit computing solutions powered by AMD64 technology.”
AMD held the “topping-off” ceremony for its next-generation 300mm manufacturing facility, AMD Fab 36, in Dresden, Germany. According to AMD chairman of the board, president and CEO Hector Ruiz, the facility “will help ensure we have the capacity required to meet our customers’ - and their customers’ - needs for pervasive 64bit computing solutions powered by AMD64 technology.”

“Less than six months after we broke ground for AMD Fab 36, the first significant phase of our 300mm wafer fab project has been completed successfully, and we are well on our way to meeting our overall project schedule,” reports Hans Deppe, vice president and general manager for AMD Saxony. “We have now begun to install the necessary infrastructure that will allow us to be ready for equipment towards the end of the year in preparation for our planned first production shipments in H1 2006.”

The topping-off ceremony was attended by Germany’s leading politician, Federal Chancellor Gerhard Schroder, and Professor Dr Georg Milbradt, Minister President of the Free State of Saxony.

The first 300mm silicon test wafers at AMD Fab 36 are scheduled for mid-2005. Hiring for AMD Fab 36 is underway, and headcount for the new fab is planned to reach approximately 1000 by 2007. Investment in AMD Fab 36 is expected to reach $2.5bn up to 2007. Construction of a new, dedicated 24MW energy centre has also begun next to the AMD Fab 36 complex.

When completed and fully operational, AMD Fab 36 will be powered by the third-generation of AMD’s Automated Precision Manufacturing (APM 3.0) advanced process control technology. APM is a suite of more than 250 AMD-patented or patent-pending fab automation technologies that aim at maximised yields and minimised per-wafer cost.

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