ICOS buys up Siemens wafer inspection business
The wafer inspection systems contain advanced wafer handling and image acquisition features and are capable of detecting defects down to 0.2microns, making them suitable for back-end and front-end wafer level inspection up to 300mm wafer diameters.
Anton DeProft, president and CEO at ICOS, comments: "Since multiple systems have been installed at pilot customers, the acquired technology is ready for commercialisation and we expect this acquisition to become accretive as soon as early next year. Further, we plan to integrate our own developed 3D inspection capability into the acquired systems in order to address the segment of the market that demands a combination of 2D and 3D wafer inspection systems."
DeProft adds: "Strategically, this acquisition fits very well in the wafer level packaging trend and the increasing overlap between front-end and back-end processes, where we see tremendous opportunities."
