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Carl Zeiss to supply immersion litho assessment system to Sematech

International Sematech will charter the semiconductor metrology systems division of Carl Zeiss SMT to design and develop a next-generation of the proprietary Aerial Image Measurement System (AIMS) for defect review of 193nm immersion lithography photomasks. The new 193i nm AIMS platform is seen as being critical to the development and manufacturing of photomasks targeted at the 65nm and 45nm technology nodes.
International Sematech will charter the semiconductor metrology systems division of Carl Zeiss SMT to design and develop a next-generation of the proprietary Aerial Image Measurement System (AIMS) for defect review of 193nm immersion lithography photomasks. The new 193i nm AIMS platform is seen as being critical to the development and manufacturing of photomasks targeted at the 65nm and 45nm technology nodes.

A first alpha tool of the 193i nm AIMS platform is to be made available to Sematech and its member companies by Q4 2005. Commercial availability is due as early as 2006, in-line with the expected introduction of 193nm immersion lithography into volume chip production by 2007.

Recently, CZ SMT celebrated the 10th anniversary of its proprietary AIMS technology for advanced photomask inspection and review. AIMS systems are used to emulate lithography wafer exposure systems and enable fast and reliable assessments of photomask defect printability, mask critical dimensions (CD) and success verification of photomask defect repairs. This eliminates the need to perform time- and money-consuming test wafer exposures during photomask analysis and verification.

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