News Article
SUSS closes two deals in Taiwan
Taiwan based Siliconware Precision Industries (SPIL) has ordered lithography systems and coat/bake/develop tracks from SUSS MicroTec. SPIL is one of the world's largest semiconductor packaging and testing companies. This new business represents additional follow-on 300mm business from this customer.
Taiwan based Siliconware Precision Industries (SPIL) has ordered lithography systems and coat/bake/develop tracks from SUSS MicroTec. SPIL is one of the world's largest semiconductor packaging and testing companies. This new business represents additional follow-on 300mm business from this customer.
The order includes SUSS' MA300Plus 1X full-field lithography systems (1XFFL) and ACS300Plus wafer-processing cluster, in support of 300mm production ramping at SPIL's advanced wafer bumping facility in Taiwan. The shipments include key elements of SUSS' SupraYield technology. Installations will begin in Q2 2004.
SUSS has also received an additional lithography order from another Taiwan company, XinTec. The order adds a 200mm 1XFFL exposure (1X full-field lithography) tool. XinTec will use the system for production of Shellcase's wafer-level chip size packaging (CSP) technology.
The 1XFFL exposure systems are designed to align and expose the entire wafer in one step leading to a significant reduction of process cycle time.
