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News Article

Nokia/ST seek mobile phone camera standardisation

Nokia and STMicroelectronics are releasing a comprehensive specification for camera modules aimed at standardising this component in mobile devices. The Standard Mobile Imaging Architecture (SMIA) specification will cover all aspects of the modules, including electrical, mechanical and functional interfaces along with other key areas such as characterisation, optical performance and reliability.
Nokia and STMicroelectronics are releasing a comprehensive specification for camera modules aimed at standardising this component in mobile devices. The Standard Mobile Imaging Architecture (SMIA) specification will cover all aspects of the modules, including electrical, mechanical and functional interfaces along with other key areas such as characterisation, optical performance and reliability.

The SMIA has six chapters:

  • Electrical interface for the physical layer (voltage levels, pin-count, timing), data rate (up to 650Mb/sec), EMI (electro-magnetic interference) performance and output image format
  • Functional specification for frame and field formats, register maps for set-up and control along with three profiles to help easy video usability with high resolution sensors
  • Mechanical interface with a family of modules that provide mechanical outlines specifically designed for volume manufacturing
  • Characterisation chapter for optical-performance metrics and sensor noise standards
  • Reliability including environmental-test and drop-test standards
  • Software model including reference device drivers and architecture

    "Nokia recently estimated that the camera phone market would exceed 200mn units this year," reports Janne Haavisto, Nokia director for camera techology. "SMIA's target is to streamline and accelerate the camera module development, ultimately contributing to creation of the state-of art imaging mobile devices, independent of vendors."

    "ST and Nokia have worked on this specification for more than two years and both companies are contributing significant intellectual property into SMIA," adds Marc Vasseur, general manager of ST's Imaging division. "ST has been immensely successful in this market due to best-in-class pixel performance, sensor and module development capabilities, and full ownership of the manufacturing flow."

    Nokia and ST hold key patents and other intellectual property in the SMIA specification, but both companies have decided to open these up to any third party and will not assert those rights against anyone implementing a fully compliant SMIA module. No fee or royalty will be levied.

    A simple license form can be found on http://www.smia-forum.org

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