News Article
Umicore takes EVG wafer bonding technology
EV Group (EVG) has shipped an EVG850 production bonder to a new US customer, Umicore Semiconductor Processing (USP) in Massachusetts. The EVG850 features EV Group's low-temperature, plasma-bonding technology.
EV Group (EVG) has shipped an EVG850 production bonder to a new US customer, Umicore Semiconductor Processing (USP) in Massachusetts. The EVG850 features EV Group's low-temperature, plasma-bonding technology.
USP produces ultra-flat and thin silicon and bonded thick-film silicon-on-insulator (SOI) for a variety of applications, including MEMS, MOEMS, microelectronics and optoelectronics. Substrate diameters of 100mm, 125mm, 150mm and 200mm will be produced.
USP is part of Umicore, a Belgian precious-metals and advanced-materials producer.
