Intel moves forward with EUV
The EUV tool and mask pilot line will be able to print circuits with feature sizes as small as 30nm in preparation for the 15nm resolution that will be required when EUV lithography goes into production. Intel reports that the smallest feature sizes being printed today in its manufacturing facilities measures 50nm.
Intel will use the micro exposure tool (MET) to address two key challenges. The first is photoresist development. The second is to study the impact of imperfections on the mask. The MET will also allow Intel to focus on optimising the variables that are required for printing the tiny features required in a high-volume manufacturing setting.
The company has made strategic investments in research and development and entered into joint development programmes with companies such as Cymer, Media Lario and NaWoTec.
