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ST readies epassport chip

STMicroelectronics has developed dual-interface (contact and contactless) secure ICs for biometric records and personal information with possible application to ePassports under the International Civil Aviation Organisation (ICAO) programme.
STMicroelectronics has developed dual-interface (contact and contactless) secure ICs for biometric records and personal information with possible application to ePassports under the International Civil Aviation Organisation (ICAO) programme.

The ST19WR66 device offers 66kBytes of EEPROM. STÕs non-volatile memory can retain data for more than 10 years. User ROM capacity of 224kBytes can be used to store operating system and program code. The 6kBytes of user RAM is combined with an 8bit secure MCU to provide fast data processing for rapid passport/ID personalisation during the manufacturing stage and fast verification in the field.

ST is involved in a number of government-sponsored programmes, such as the Juki card project in Japan using the ST19XR34 dual-interface product, an Italian ID card, Indian driving licenses, a French health card scheme and a Brunei ID project.

The ST19WR66 product will be ready to ship for passport pilot programmes in Q4 2004, qualified and certified to ISO15408 Common Criteria EAL4+ for volume production by Q1 2005. The delivery will include not only the chip, but also contactless packaging to satisfy ICAO specifications.

Infineon Technologies is also looking to market electronic identity card and passport chip products and is seeking to take part in the first global tests on electronic ID cards and passports later this year (Bulletin 541, July 9, 2004).

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