Oki Electric Industry claims the world's thinnest ultra small tri-axis accelerometer module, the ML8950. The 1.4mm thick micro-electromechanical system (MEMS) chip sensor has been integrated with the control IC to create a device in a package. In addition to detecting the tri-axis (X, Y and Z) acceleration (+/-3g), the accelerometer module can also detect inclination and impact shock as well as measure the degree of inclination and vibration. The signal is output in a digital format.
Oki Electric Industry claims the world's thinnest ultra small tri-axis accelerometer module, the ML8950. The 1.4mm thick micro-electromechanical system (MEMS) chip sensor has been integrated with the control IC to create a device in a package. In addition to detecting the tri-axis (X, Y and Z) acceleration (+/-3g), the accelerometer module can also detect inclination and impact shock as well as measure the degree of inclination and vibration. The signal is output in a digital format.
The company is looking for design wins in the mobile phone, mobile equipment, hard disk drive (HDD) and entertainment markets. Sample shipments are due in Japan and North America in October 2004 and volume shipments in April 2005.
The micromachined sensor is built on silicon on insulator (SOI) wafers. The control IC chip is equipped with a signal amplification circuit, a control circuit, an analogue/digital converter and a temperature compensating circuit.
This is Oki's first product for the MEMS market, in which it has been providing production services using its silicon micro fabrication technology since 1999. Oki plans to reach sales of JPY10bn by the fiscal year ending March 2007 through its MEMS technology and development of sensors integrated with control ICs.