News Article
Platform to combine nano-imprint and low-T bonding
UK company Applied Microengineering (AML) gave details of its planned use for its recent UK government DTI grant of GBP678,000 to the LOBEL project that will develop a new nano device production tool for micro polymer embossing and nano-imprint lithography (NIL) and surface activation for low-temperature wafer bonding (Bulletin 551, September 15, 2004).
UK company Applied Microengineering (AML) gave details of its planned use for its recent UK government DTI grant of GBP678,000 to the LOBEL project that will develop a new nano device production tool for micro polymer embossing and nano-imprint lithography (NIL) and surface activation for low-temperature wafer bonding (Bulletin 551, September 15, 2004).
The new processes will be designed for use on AMLs in-situ aligner-bonder platform. NIL will require an exceptional degree of mechanical stability and precision at elevated temperatures and surface activation needs the controlled exposure of the wafer to energetic ions. The project will develop a proof-of-concept machine.
Imperial College London and the Open University Research Unit, as well as engineering company Cranfield Precision, will be partners in the project.
