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News Article

New openings in China

Thursday 23rd September 2004

Infineon has announced the formal opening of a new memory chip packaging facility in China. Infineon Technologies Suzhou was opened in the presence of the Suzhou Party Secretary Wang Min. Work on constructing the new production facility has begun in October 2003, and volume production is planned to commence in early 2005. Once completed, the facility will have a maximum capacity of up to 1bn memory chips a year.

Infineon has announced the formal opening of a new memory chip packaging facility in China. Infineon Technologies Suzhou was opened in the presence of the Suzhou Party Secretary Wang Min. Work on constructing the new production facility has begun in October 2003, and volume production is planned to commence in early 2005. Once completed, the facility will have a maximum capacity of up to 1bn memory chips a year.

The new facility will be developed in a number of stages as dictated by growth and trends in the global semiconductor market. Total planned investment in the project amounts to $1bn. When operating at full capacity, Infineon Technologies Suzhou will employ more than 1000 people.

Simultaneously, Infineon inaugurated an IT development centre in Suzhou focusing on manufacturing processes. The development centre will employ between 80 and 100 engineers supporting the backend Suzhou manufacturing fab and becoming part of Infineon’s worldwide IT Manufacturing Centre of Competence.



New opening in China (Part 2)

AMD today announced plans for the formation of a Greater China headquarters in Beijing. AMD's Greater China headquarters will be responsible for all operations in China, Hong Kong and Taiwan and will help ensure AMD's operations are best aligned with the needs of the China market.

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