ASMI joins IMEC sub-45nm research
The equipment includes a Polygon ALCVD system for atomic layer deposition of gate insulators and gate electrodes and a Levitor rapid thermal processing (RTP) system for the formation of junctions and contacts in very small sub-45nm transistors. IMEC will also be getting an Epsilon epitaxy system to create advanced transistor structures with improved current carrying capability and an A412 vertical furnace, for general, multiple applications in the IMEC pilot line.
"IMEC will use this equipment to research very advanced devices with feature sizes of 45nm and less, employing new materials, new structures and new processing methods" says Ivo Raaijmakers, chief technology officer and director of R&D of ASM International's Front-end Operations. "Together, the equipment set can be used to produce almost all materials for transistor and memory structures foreseen in the nanotechnology era."
