Chip-to-wafer for hybrid integration
AC2W technology offers high device density through stacked devices, short interconnects and higher functional density. It enables the integration of various device technologies such as hybrid integration of IC and micro-electromechanical system (MEMS) functionality. The new equipment platform has already been successfully installed at Infineon Technologies.
The R&D to create the technology was carried out in a joint R&D project combining Datacon's expertise in chip-bonding and key flip-chip bonding technologies with the wafer-level know-how of the EV Group (Bulletin 508, November 26, 2003). The companies now hope to take the manufacturing technology out to the industry and to expand its scope.
The EVG540C2W chip-to-wafer bonder permanently bonds a wafer with single devices, such as chips, under defined process conditions, after they have been fixed with a temporary fixing agent in a high-precision flip-chip bonder from Datacon. The technology used for the bonding process is called SOLID F2F, in which "SOLID" stands for solid liquid interdiffusion, a technology that uses a copper-tin soldering process. F2F stands for face-to-face and describes the orientation of the two chips with their active side facing each other.
"Our equipment allows a pre-bonding performance of up to 8500 chips per hour together with a placement accuracy of 10microns at 3sigma deviation," says Helmut Rutterschmidt, president and director of the board at Datacon. "Our 8800 FC Quantum can handle top chips as thin as 50microns and wafers up to 300mm diameter."
Advanced-chip-to-wafer-technology can generate packages that are an alternative to expensive embedded processes. The companies believe that the new process will save time and money by combining the highest throughput and utilisation of well established flip-chip and die attach techniques with permanent bonding under well-controlled process parameters.
