Trikon sells tool for Leti acoustic wave R&D
David Butler, director of Marketing at Trikon, comments: "The Leti sale is significant as this is one of the first 200mm BAW lines anywhere in the world. Their intention is to integrate BAW devices with logic circuits to reduce costs and form factor over current discrete approaches. Fabricating BAW devices above integrated circuitry will drive this market forward and open new applications for the technology."
BAW device yield is directly linked to thickness and material quality of the piezoelectric layer. Trikon reports that it has developed a number of key technology enablers in the arena of insulator deposition, surface treatments to enable correct filter quality on multiple electrode types, and most importantly thickness control within wafer and wafer to wafer. The Sigma fxP tool can be configured with patented hardware specifically developed for BAW deposition applications.
