News Article
Snowball cleaner makes 13th sale
FSI International reports that "a leading European IC manufacturer" has purchased multiple ANTARES CX CryoKinetic cleaning systems after a successful demonstration of defect removal in an on-site evaluation program. The systems will be used on advanced devices for both front-end-of-line (FEOL) and back-end-of-line (BEOL) defect removal on planar and surface patterned structures.
FSI International reports that "a leading European IC manufacturer" has purchased multiple ANTARES CX CryoKinetic cleaning systems after a successful demonstration of defect removal in an on-site evaluation program. The systems will be used on advanced devices for both front-end-of-line (FEOL) and back-end-of-line (BEOL) defect removal on planar and surface patterned structures.
The order marks the 13th fab to use ANTARES. The CryoKinetic process uses inert gases frozen at cryogenic temperatures to clean the wafer. Effectively, the system fires micro-snowballs at the wafer. The CryoKinetic process replaces scrubber technology, which uses large amounts of water and sometimes requires wet chemicals too. Once the snowballs heat up, the inert gas just evaporates, leaving a dry wafer.
