News Article
More flexible infrared package
OSRAM Opto Semiconductors has developed new packaging technology for use in its infrared (IR) emitter diodes and detectors. The Molded Interconnect Device Light Emitting Diodes (MIDLEDs) surface-mount technology (SMT) devices have a construction that offers electrical contact pads on both the bottom and side of the package. This enables the same part to be either used as a top-facing (Z axis) or side-facing (X axis) solution, providing greater design flexibility.
OSRAM Opto Semiconductors has developed new packaging technology for use in its infrared (IR) emitter diodes and detectors. The Molded Interconnect Device Light Emitting Diodes (MIDLEDs) surface-mount technology (SMT) devices have a construction that offers electrical contact pads on both the bottom and side of the package. This enables the same part to be either used as a top-facing (Z axis) or side-facing (X axis) solution, providing greater design flexibility.
The MIDLED package additionally provides an internal metallised reflector as well as a beam angle of +/-20degrees, enabling three times the output intensity of existing TOPLED emitters at a fraction of the size. Internal reflectors in the package are designed to eliminate the need for external lens assemblies. Expected applications of the package technology include steering-angle sensors, rain sensors, light curtains, miniature interrupters, coin changers, reflective sensors, IR data transmitters and remote controls.
OSRAM's MIDLEDs are sampling and mass volume production will begin in December 2004. Additional versions are in development and will be available as prototypes within the next two quarters.
